54 search results - page 5 / 11 » System chip test: how will it impact your design |
HIPEAC
2009
Springer
14 years 1 months ago
2009
Springer
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
ASPDAC
2006
ACM
14 years 29 days ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
ICCD
2008
IEEE
14 years 3 months ago
2008
IEEE
— Extreme scaling practices in silicon technology are quickly leading to integrated circuit components with limited reliability, where phenomena such as early-transistor failures...
DATE
2007
IEEE
14 years 1 months ago
2007
IEEE
- The intrinsic capability brought by each new technology node opens the way to a broad range of system integration options and continuously enables new applications to be integrat...
SIGSOFT
2007
ACM
14 years 7 months ago
2007
ACM
The testing of the performance of opportunistic communication protocols and applications is usually done through simulation as i) deployments are expensive and should be left to t...