Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
The use of Application Specific Instruction-set Processors (ASIP) is a solution to the problem of increasing complexity in embedded systems design. One of the major challenges in...
Alessandro G. Di Nuovo, Maurizio Palesi, Davide Pa...
“The curse of dimensionality” is pertinent to many learning algorithms, and it denotes the drastic raise of computational complexity and classification error in high dimension...
Mykola Pechenizkiy, Seppo Puuronen, Alexey Tsymbal
The relentless push for high performance in custom digital circuits has led to renewed emphasis on circuit optimization or tuning. The parameters of the optimization are typically...
Background: Overfitting the data is a salient issue for classifier design in small-sample settings. This is why selecting a classifier from a constrained family of classifiers, on...
Jianping Hua, James Lowey, Zixiang Xiong, Edward R...