With the multitude of existing and upcoming wireless standards, it is becoming increasingly difficult for hardware-only baseband processing solutions to adapt to the rapidly chan...
Mark Woh, Yuan Lin, Sangwon Seo, Scott A. Mahlke, ...
This paper proposes the use of empirical modeling techniques for building microarchitecture sensitive models for compiler optimizations. The models we build relate program perform...
Kapil Vaswani, Matthew J. Thazhuthaveetil, Y. N. S...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Parameter variation due to manufacturing error will be an unavoidable consequence of technology scaling in future generations. The impact of random variation in physical factors s...
Ke Meng, Frank Huebbers, Russ Joseph, Yehea I. Ism...
Caches are designed to provide the best tradeoff between access speed and capacity for a set of target applications. Unfortunately, different applications, and even different phas...