Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
In this paper, we study the interdependency between leakage energy and chip temperature in real-time systems. We observe that the temperature variation on chip has a large impact ...
Abstract--Reducing energy consumption for high end computing can bring various benefits such as, reduce operating costs, increase system reliability, and environment respect. This ...
Lizhe Wang, Gregor von Laszewski, Jai Dayal, Fugan...
In this paper, we address the power-aware scheduling of sporadic constrained-deadline hard real-time tasks using dynamic voltage scaling upon multiprocessor platforms. We propose ...
In this work we consider battery powered portable systems which either have Field Programmable Gate Arrays (FPGA) or voltage and frequency scalable processors as their main proces...