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» Tera-scale computing and interconnect challenges
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ICPP
2008
IEEE
14 years 1 months ago
Thermal Management for 3D Processors via Task Scheduling
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...
ASAP
2007
IEEE
111views Hardware» more  ASAP 2007»
14 years 1 months ago
Entropy Coding on a Programmable Processor Array for Multimedia SoC
Entropy encoding and decoding is a crucial part of any multimedia system that can be highly demanding in terms of computing power. Hardware implementation of typical compression a...
Roberto R. Osorio, Javier D. Bruguera
IEEESCC
2007
IEEE
14 years 1 months ago
Brave New Web: Emerging Design Principles and Technologies as Enablers of a Global SOA
Web Services have experienced great interest during the last years as they were expected to play a key role as enablers of seamless application-to-application integration both wit...
Christoph Schroth, Oliver Christ
SOFSEM
2007
Springer
14 years 1 months ago
Personalized Presentation in Web-Based Information Systems
Abstract. Large information spaces and complex functionality of contemporary systems together with the advent of the Semantic Web are big challenges for the design of simple yet po...
Michal Tvarozek, Michal Barla, Mária Bielik...
CLUSTER
2006
IEEE
14 years 1 months ago
Cluster-based IP Router: Implementation and Evaluation
IP routers are now increasingly expected to do more than just traditional packet forwarding – they must be extensible as well as scalable. It is a challenge to design a router a...
Qinghua Ye, Mike H. MacGregor