As the number of integrated IP cores in the current System-on-Chips (SoCs) keeps increasing, communication requirements among cores can not be sufficiently satisfied using either ...
Jun Ho Bahn, Seung Eun Lee, Yoon Seok Yang, Jungso...
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
Motivation: Proteins of all kinds can self-assemble into highly ordered β-sheet aggregates known as amyloid fibrils, important both biologically and clinically. However, the spe...
This paper shows how computational Riemannian manifold can be used to solve several problems in computer vision and graphics. Indeed, Voronoi segmentations and Delaunay graphs comp...
With the increase of amount of transistors which can be contained on a chip and the constant expectation for more sophisticated applications, the design of Systems-on-Chip (SoC) is...