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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 2 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
HIPEAC
2009
Springer
14 years 3 months ago
Adapting Application Mapping to Systematic Within-Die Process Variations on Chip Multiprocessors
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
Yang Ding, Mahmut T. Kandemir, Mary Jane Irwin, Pa...
SENSYS
2010
ACM
13 years 6 months ago
Efficient diagnostic tracing for wireless sensor networks
Wireless sensor networks (WSNs) are hard to program due to unconventional programming models used to satisfy stringent resource constraints. The common event-driven concurrent pro...
Vinaitheerthan Sundaram, Patrick Th. Eugster, Xian...
SOFTVIS
2010
ACM
13 years 6 months ago
Dependence cluster visualization
Large clusters of mutual dependence have long been regarded as a problem impeding comprehension, testing, maintenance, and reverse engineering. An effective visualization can aid ...
Syed S. Islam, Jens Krinke, David Binkley
ICTAC
2010
Springer
13 years 7 months ago
Preference and Non-deterministic Choice
Material Flow Abstraction of Manufacturing Systems. ‣Umberto Costa, Ivan de Medeiros Jr and Marcel Oliveira. Specification and Verification of a MPI Implementation for a MP-SoC...
Bill Stoddart, Frank Zeyda, Steve Dunne