Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
Yang Ding, Mahmut T. Kandemir, Mary Jane Irwin, Pa...
Wireless sensor networks (WSNs) are hard to program due to unconventional programming models used to satisfy stringent resource constraints. The common event-driven concurrent pro...
Vinaitheerthan Sundaram, Patrick Th. Eugster, Xian...
Large clusters of mutual dependence have long been regarded as a problem impeding comprehension, testing, maintenance, and reverse engineering. An effective visualization can aid ...
Material Flow Abstraction of Manufacturing Systems. ‣Umberto Costa, Ivan de Medeiros Jr and Marcel Oliveira. Specification and Verification of a MPI Implementation for a MP-SoC...