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DAC
2011
ACM
12 years 7 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
ICNP
2007
IEEE
14 years 1 months ago
A Simple Model for Analyzing P2P Streaming Protocols
— P2P streaming tries to achieve scalability (like P2P file distribution) and at the same time meet real-time playback requirements. It is a challenging problem still not well u...
Yipeng Zhou, Dah-Ming Chiu, John C. S. Lui
INFOCOM
2007
IEEE
14 years 1 months ago
Self-Adaptive On Demand Geographic Routing Protocols for Mobile Ad-hoc Networks
— It has been a big challenge to develop routing protocol that can meet different application needs and optimize routing paths according to the topology change in mobile ad hoc n...
X. Xiang, Z. Zhou, X. Wang
ICCAD
2006
IEEE
103views Hardware» more  ICCAD 2006»
14 years 4 months ago
A statistical framework for post-silicon tuning through body bias clustering
Adaptive body biasing (ABB) is a powerful technique that allows post-silicon tuning of individual manufactured dies such that each die optimally meets the delay and power constrai...
Sarvesh H. Kulkarni, Dennis Sylvester, David Blaau...
JSAC
2010
107views more  JSAC 2010»
13 years 5 months ago
Online learning in autonomic multi-hop wireless networks for transmitting mission-critical applications
Abstract—In this paper, we study how to optimize the transmission decisions of nodes aimed at supporting mission-critical applications, such as surveillance, security monitoring,...
Hsien-Po Shiang, Mihaela van der Schaar