2343 search results - page 468 / 469 » The Locomotive Routing Problem |
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
IHI
2010
13 years 2 months ago
2010
Regulations in various countries permit the reuse of health information without patient authorization provided the data is "de-identified". In the United States, for ins...
ICDE
2011
IEEE
12 years 11 months ago
2011
IEEE
— In a wireless sensor network (WSN), each sensor monitors environmental parameters, and reports its readings to a base station, possibly through other nodes. A sensor works in c...
INFOCOM
2011
IEEE
12 years 11 months ago
2011
IEEE
—We address pairwise and (for the first time) triple key establishment problems in wireless sensor networks (WSN). We use combinatorial designs to establish pairwise keys betwee...
ISPD
2012
ACM
12 years 3 months ago
2012
ACM
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...