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3DIC
2009
IEEE
14 years 2 months ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
SC
2009
ACM
14 years 4 months ago
2009
ACM
The scalability of future massively parallel processing (MPP) systems is being severely challenged by high failure rates. Current hard disk drive (HDD) checkpointing results in ov...
ICMCS
2005
IEEE
14 years 3 months ago
2005
IEEE
This paper describes an implementation of vertex weighting for real-time animation of 3D trees as a result of wind force and direction. This method improves over similar technique...
COMCOM
2000
13 years 9 months ago
2000
Distributed multimedia applications will be an important part of tomorrow's application mix and require appropriate operating system (OS) support. Neither hard real-time solu...
ASPDAC
2009
ACM
14 years 4 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...