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ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
14 years 3 months ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
ASPLOS
2010
ACM
14 years 2 months ago
An asymmetric distributed shared memory model for heterogeneous parallel systems
Heterogeneous computing combines general purpose CPUs with accelerators to efficiently execute both sequential control-intensive and data-parallel phases of applications. Existin...
Isaac Gelado, Javier Cabezas, Nacho Navarro, John ...
ICS
2001
Tsinghua U.
14 years 2 months ago
Global optimization techniques for automatic parallelization of hybrid applications
This paper presents a novel technique to perform global optimization of communication and preprocessing calls in the presence of array accesses with arbitrary subscripts. Our sche...
Dhruva R. Chakrabarti, Prithviraj Banerjee
MMB
1999
Springer
249views Communications» more  MMB 1999»
14 years 2 months ago
A Development Platform for the Design and Optimization of Mobile Radio Networks
The rapidly increasing traffic demand from mobile users forces network operators and service providers to extend and optimize existing networks as well as to plan entirely new mo...
Jürgen Deissner, Gerhard Fettweis, Jörg ...
CSB
2004
IEEE
135views Bioinformatics» more  CSB 2004»
14 years 1 months ago
Selection of Patient Samples and Genes for Outcome Prediction
Gene expression profiles with clinical outcome data enable monitoring of disease progression and prediction of patient survival at the molecular level. We present a new computatio...
Huiqing Liu, Jinyan Li, Limsoon Wong