—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
Two Simple structures of low-power Dual-edge triggered Static Pulsed Flip-Flops (DSPFF) are presented in this paper. They are composed of a dualedge pulse generator and a static f...
Multi-domain clock skew scheduling is a cost effective technique for performance improvement. However, the required wire length and area overhead due to phase shifters for realizin...
Naser MohammadZadeh, Minoo Mirsaeedi, Ali Jahanian...
A summary of electrical and optical approaches to clock distribution within high-performance microprocessors is presented. System-level properties of intrachip electrical clock dis...
A. V. Mule, Elias N. Glytsis, Thomas K. Gaylord, J...
Abstract. This paper presents markerClock, a communication appliance embedded into a clock and designed for seniors as a simple and intuitive device. MarkerClock enhances seniorsâ€...