— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
In this paper, we quantify the adverse effect of file sharing on the performance of reliable distributed applications. We demonstrate that file sharing incurs significant overhead...
The use of formal model based (FMB) methods to evaluate the quality of the components is an important research area. Except for a growing number of exceptions, FMB methods are sti...
Hye Yeon Kim, Kshamta Jerath, Frederick T. Sheldon
Abstract — Distributed sensor system applications (e.g., wireless sensor networks) have been studied extensively in recent years. Such applications involve resource-limited embed...
Chung-Ching Shen, Roni Kupershtok, Shuvra S. Bhatt...
There are currently two approaches to providing Byzantine-fault-tolerant state machine replication: a replica-based approach, e.g., BFT, that uses communication between replicas t...
James A. Cowling, Daniel S. Myers, Barbara Liskov,...