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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
14 years 1 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
ECOWS
2009
Springer
14 years 1 months ago
An Analysis of Windows Workflow's Control-Flow Expressiveness
The Windows Workflow Foundation (WF) has been introduced as part of the .NET framework as a means of creating workflow-centric applications. Its intended field of application is br...
Marco Zapletal, Wil M. P. van der Aalst, Nick Russ...
APCHI
2004
IEEE
14 years 1 months ago
Understanding Interaction Experience in Mobile Learning
The convergence of mobile technology and e-learning has generated considerable excitement among both practitioners and academics. Mass media continually promotes novel idea about m...
Fariza Hanis Abdul Razak
CIKM
2006
Springer
14 years 1 months ago
Mining compressed commodity workflows from massive RFID data sets
Radio Frequency Identification (RFID) technology is fast becoming a prevalent tool in tracking commodities in supply chain management applications. The movement of commodities thr...
Hector Gonzalez, Jiawei Han, Xiaolei Li
ERSHOV
2006
Springer
14 years 1 months ago
Streaming Networks for Coordinating Data-Parallel Programs
A new coordination language for distributed data-parallel programs is presented, call SNet. The intention of SNet is to introduce advanced structuring techniques into a coordinatio...
Clemens Grelck, Sven-Bodo Scholz, Alexander V. Sha...
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