— The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip architecture innovations. One direction is in the extens...
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
In this paper we present NoCEE, a fast and accurate method for extracting energy models for packet-switched Network on Chip (NoC) routers. Linear regression is used to model the r...
Power management has become increasingly necessary in large-scale datacenters to address costs and limitations in cooling or power delivery. This paper explores how to integrate p...
—Collaborations by the use of inter-organizational business processes can help companies to achieve a competitive edge over competing businesses. Typically, these collaborations ...