104 search results - page 14 / 21 » Thermal Characterization and Thermal Management in Processor... |
ISLPED
2009
ACM
14 years 2 months ago
2009
ACM
With the popularity of multi-core architecture, to sustain the memory demands from different cores, the memory system is expected to grow significantly in both speed and capacit...
VLSID
2009
IEEE
14 years 8 months ago
2009
IEEE
Power density has been increasing at an alarming rate in recent processor generations resulting in high on-chip temperature. Higher temperature results in poor reliability and inc...
GLVLSI
2003
IEEE
14 years 1 months ago
2003
IEEE
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
- With the increasing levels of variability in the behavior of manufactured nano-scale devices and dramatic changes in the power density on a chip, timely identification of hot spo...
GLVLSI
2008
IEEE
13 years 9 months ago
2008
IEEE
The main contribution of this work is an analytical model for finding the upper bound on the temperature difference among various locations on the die. The proposed model can be u...