104 search results - page 17 / 21 » Thermal Characterization and Thermal Management in Processor... |
GLVLSI
2006
IEEE
14 years 1 months ago
2006
IEEE
Reliability has become a significant challenge for system design in new process technologies. Higher integration levels dramatically increase power densities, which leads to high...
GECCO
2004
Springer
14 years 1 months ago
2004
Springer
Portable embedded systems are being driven by consumer demands to be thermally efficient, perform faster, and have longer battery life. To design such a system, various hardware un...
EUROSYS
2006
ACM
14 years 4 months ago
2006
ACM
Actions usually taken to prevent processors from overheating, such as decreasing the frequency or stopping the execution flow, also degrade performance. Multiprocessor systems, h...
ICAC
2009
IEEE
14 years 2 months ago
2009
IEEE
: © vManage: Loosely Coupled Platform and Virtualization Management in Data Centers Sanjay Kumar, Vanish Talwar, Vibhore Kumar, Parthasarathy Ranganathan, Karsten Schwan HP Labora...
ISLPED
2010
ACM
13 years 8 months ago
2010
ACM
The ongoing scaling of semiconductor technology is causing severe increase of on-chip power density and temperature in microprocessors. This has raised urgent requirement for both...