104 search results - page 5 / 21 » Thermal Characterization and Thermal Management in Processor... |
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
FPL
2006
Springer
13 years 11 months ago
2006
Springer
Given large circuit sizes, high clock frequencies, and possibly extreme operating environments, Field Programmable Gate Arrays (FPGAs) are capable of heating beyond their designed...
ASPDAC
2006
ACM
14 years 1 months ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
MR
2006
13 years 7 months ago
2006
HPCA
2006
IEEE
14 years 8 months ago
2006
IEEE
This paper describes the first infrastructure for integrated studies of the performance and thermal behavior of storage systems. Using microbenchmarks running on this infrastructu...