104 search results - page 9 / 21 » Thermal Characterization and Thermal Management in Processor... |
DAC
2008
ACM
14 years 8 months ago
2008
ACM
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new model of a thermally-managed system, where a stoch...
ISVLSI
2006
IEEE
14 years 1 months ago
2006
IEEE
Thermal management is becoming increasingly important in circuit designs with high power density. Circuits that overheat beyond specified operating conditions may suffer timing f...
COMSWARE
2007
IEEE
14 years 2 months ago
2007
IEEE
Abstract— Minimizing the energy cost and improving thermal performance of power-limited datacenters, deploying large computing clusters, are the key issues towards optimizing the...
ISPASS
2005
IEEE
14 years 1 months ago
2005
IEEE
We have previously presented Qsilver, a flexible simulation system for graphics architectures. In this paper we describe our extensions to this system, which we use— instrument...
ICCAD
2010
IEEE
13 years 5 months ago
2010
IEEE
3D stacked circuits reduce communication delay in multicore system-on-chips (SoCs) and enable heterogeneous integration of cores, memories, sensors, and RF devices. However, vertic...