14 search results - page 1 / 3 » Thermal Management for 3D Processors via Task Scheduling |
ICPP
2008
IEEE
14 years 1 months ago
2008
IEEE
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
TPDS
2010
13 years 5 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
CODES
2007
IEEE
14 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
TACO
2010
13 years 5 months ago
2010
ISPASS
2008
IEEE
14 years 1 months ago
2008
IEEE
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...