26 search results - page 4 / 6 » Thermal via placement in 3D ICs |
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
ASPDAC
2005
ACM
14 years 1 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...
NANONET
2009
Springer
14 years 5 days ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
DAC
2009
ACM
14 years 8 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
ASPDAC
2008
ACM
13 years 9 months ago
2008
ACM
The capability of predicting the temperature profile is critically important for timing estimation, leakage reduction, power estimation, hotspot avoidance and reliability concerns ...