1476 search results - page 235 / 296 » Three-dimensional integrated circuits |
DAC
2006
ACM
14 years 11 months ago
2006
ACM
Modern high performance processors employ advanced techniques for thermal management, which rely on accurate readings of on-die thermal sensors. As the importance of thermal effec...
DAC
2006
ACM
14 years 11 months ago
2006
ACM
Droplet-based microfluidic biochips have recently gained much attention and are expected to revolutionize the biological laboratory procedure. As biochips are adopted for the comp...
CHES
2009
Springer
14 years 10 months ago
2009
Springer
Abstract. The general trend in semiconductor industry to separate design from fabrication leads to potential threats from untrusted integrated circuit foundries. In particular, mal...
CHES
2009
Springer
14 years 10 months ago
2009
Springer
? This paper gives an overview of the place of reverse engineering (RE) in the semiconductor industry, and the techniques used to obtain information from semiconductor products. Th...
ICCD
2008
IEEE
14 years 7 months ago
2008
IEEE
— Test-access mechanisms (TAMs) and test wrappers (e.g., the IEEE Standard 1500 wrapper) facilitate the modular testing of embedded cores in a core-based system-on-chip (SOC). Su...