The verification of large radio-frequency/millimeter-wave (RF/MM) integrated circuits (ICs) has regained attention for high-performance designs beyond 90nm and 60GHz. The traditio...
Abstract-- We report our experiences in designing and implementing several hardware Trojans within the framework of the Embedded System Challenge competition that was held as part ...
This paper accurately considers wire short defects and proposes an algorithm to guarantee IC chip yield rate improvement for redundant wire insertion. Without considering yield ra...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
Three-phase shunt active power filter (APF) is often used to compensate the harmonic and reactive current derived from non-linear load. But many non-ideal factors, such as the lim...