166 search results - page 6 / 34 » Through Silicon Vias as Enablers for 3D Systems |
CVPR
2007
IEEE
14 years 9 months ago
2007
IEEE
A newly devised lightweight sensor head, combining a digital LED projector and two cameras in a stereo arrangement with access to even complicated measurable object details, is pr...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...
3DIC
2009
IEEE
14 years 17 days ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...
SI3D
1992
ACM
13 years 11 months ago
1992
ACM
The development of 3D visual simulation systemson inexpensive, commercially available graphics workstations is occurring today and will be commonplace in the near future. Such sys...
ICUMT
2009
13 years 5 months ago
2009
Abstract-- Many peer-to-peer-based virtual environment (P2PVE) solutions have been proposed recently to improve the scalability of distributed virtual environment (VE) systems. By ...