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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 6 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
SOSP
2003
ACM
14 years 6 months ago
Model-carrying code: a practical approach for safe execution of untrusted applications
This paper presents a new approach called model-carrying code (MCC) for safe execution of untrusted code. At the heart of MCC is the idea that untrusted code comes equipped with a...
R. Sekar, V. N. Venkatakrishnan, Samik Basu, Sande...
SOSP
2005
ACM
14 years 6 months ago
Capturing, indexing, clustering, and retrieving system history
We present a method for automatically extracting from a running system an indexable signature that distills the essential characteristic from a system state and that can be subjec...
Ira Cohen, Steve Zhang, Moisés Goldszmidt, ...
SOSP
2009
ACM
14 years 6 months ago
Debugging in the (very) large: ten years of implementation and experience
Windows Error Reporting (WER) is a distributed system that automates the processing of error reports coming from an installed base of a billion machines. WER has collected billion...
Kirk Glerum, Kinshuman Kinshumann, Steve Greenberg...
AOSD
2010
ACM
14 years 4 months ago
Tracking code patterns over multiple software versions with Herodotos
An important element of understanding a software code base is to identify the repetitive patterns of code it contains and how these evolve over time. Some patterns are useful to t...
Nicolas Palix, Julia L. Lawall, Gilles Muller