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MJ
2011
288views Multimedia» more  MJ 2011»
13 years 2 months ago
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
New tendencies envisage 2D/3D Multi-Processor System-On-Chip (MPSoC) as a promising solution for the consumer electronics market. MPSoCs are complex to design, as they must execute...
Pablo Garcia Del Valle, David Atienza
RTAS
2008
IEEE
14 years 1 months ago
A Hybrid DVS Scheme for Interactive 3D Games
Interactive 3D games are now widely available on a variety of mobile devices for which battery-life is a major concern. Many of these devices support voltage/frequencyscalable pro...
Yan Gu, Samarjit Chakraborty
MICRO
2007
IEEE
150views Hardware» more  MICRO 2007»
14 years 1 months ago
Leveraging 3D Technology for Improved Reliability
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
Niti Madan, Rajeev Balasubramonian