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» Trustworthy System Security through 3-D Integrated Hardware
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ISPD
2011
ACM
253views Hardware» more  ISPD 2011»
12 years 10 months ago
Assembling 2D blocks into 3D chips
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Johann Knechtel, Igor L. Markov, Jens Lienig
3DIC
2009
IEEE
184views Hardware» more  3DIC 2009»
14 years 2 months ago
Architectural evaluation of 3D stacked RRAM caches
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
Dean L. Lewis, HsienHsin S. Lee
DFT
2006
IEEE
143views VLSI» more  DFT 2006»
14 years 1 months ago
Defect Tolerant and Energy Economized DSP Plane of a 3-D Heterogeneous SoC
This paper1 discusses a defect tolerant and energy economized computing array for the DSP plane of a 3-D Heterogeneous System on a Chip. We present the J-platform, which employs c...
Vijay K. Jain, Glenn H. Chapman
ICCV
2011
IEEE
12 years 7 months ago
Manhattan Scene Understanding Using Monocular, Stereo, and 3D Features
This paper addresses scene understanding in the context of a moving camera, integrating semantic reasoning ideas from monocular vision with 3D information available through struct...
Alex Flint, David Murray, Ian Reid
DATE
2005
IEEE
154views Hardware» more  DATE 2005»
14 years 1 months ago
Secure Embedded Processing through Hardware-Assisted Run-Time Monitoring
— Security is emerging as an important concern in embedded system design. The security of embedded systems is often compromised due to vulnerabilities in “trusted” software t...
Divya Arora, Srivaths Ravi, Anand Raghunathan, Nir...