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TCAD
2008
114views more  TCAD 2008»
13 years 7 months ago
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Three-dimensional integration has the potential to improve the communication latency and integration density of chip-level multiprocessors (CMPs). However, the stacked highpower de...
Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert ...
CASES
2004
ACM
14 years 1 months ago
High-level power analysis for on-chip networks
As on-chip networks become prevalent in multiprocessor systemson-a-chip and multi-core processors, they will be an integral part of the design flow of such systems. With power in...
Noel Eisley, Li-Shiuan Peh
PATMOS
2007
Springer
14 years 1 months ago
Optimization for Real-Time Systems with Non-convex Power Versus Speed Models
Abstract. Until now, the great majority of research in low-power systems has assumed a convex power model. However, recently, due to the confluence of emerging technological and ar...
Ani Nahapetian, Foad Dabiri, Miodrag Potkonjak, Ma...
CASES
2006
ACM
14 years 1 months ago
High-level power analysis for multi-core chips
Technology trends have led to the advent of multi-core chips in the form of both general-purpose chip multiprocessors (CMPs) and embedded multi-processor systems-on-a-chip (MPSoCs...
Noel Eisley, Vassos Soteriou, Li-Shiuan Peh
SPAA
2010
ACM
13 years 7 months ago
Scheduling to minimize power consumption using submodular functions
We develop logarithmic approximation algorithms for extremely general formulations of multiprocessor multiinterval offline task scheduling to minimize power usage. Here each proce...
Erik D. Demaine, Morteza Zadimoghaddam