Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
Teaching the practical aspects of device and chip design in New Zealand presents many problems, including high manufacturing costs, long lead times, and the lack of local industry...
Richard J. Blaikie, Maan M. Alkaisi, Steven M. Dur...
In this work the design of radiofrequency CMOS circuit blocks in the 910MHz ISM band, while biasing the MOS transistor in the moderate inversion region, is analyzed. An amplifier ...
— A fully embedded tactile/force sensor system to be installed on the phalanges of a robot hand is presented in this paper. The sensor consists of a distributed array of analog t...
In-network processing is recommended for many sensor network applications to reduce communication and improve energy efficiency. However, constraints on memory, speed, and energy ...
Brandon Rumberg, David W. Graham, Vinod Kulathuman...