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DAC
2006
ACM
14 years 8 months ago
A thermally-aware performance analysis of vertically integrated (3-D) processor-memory hierarchy
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
Gian Luca Loi, Banit Agrawal, Navin Srivastava, Sh...
ACMACE
2005
ACM
14 years 1 months ago
Designing a narrative-based audio only 3D game engine
Immersing players in believable and engaging virtual environments is a common goal for many interactive computer games. While PC-based audio only games set in virtual worlds have ...
Timothy Roden, Ian Parberry
CHI
2002
ACM
14 years 7 months ago
Sketching annotations in a 3D web environment
Collaborative design review is an important part of architectural design work. The Space Pen system supports annotation and drawing on (and inside) 3D VRML/Java models using a reg...
Thomas Jung, Mark D. Gross, Ellen Yi-Luen Do
GIS
2007
ACM
14 years 8 months ago
High-level web service for 3D building information visualization and analysis
This paper presents an approach to visualize and analyze 3D building information models within virtual 3D city models. Building information models (BIMs) formalize and represent d...
Benjamin Hagedorn, Jürgen Döllner
ASPLOS
2006
ACM
14 years 1 months ago
Introspective 3D chips
While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...
Shashidhar Mysore, Banit Agrawal, Navin Srivastava...