2065 search results - page 375 / 413 » Using Architectural Models at Runtime: Research Challenges |
ICCD
2007
IEEE
14 years 4 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
ASPLOS
2010
ACM
14 years 2 months ago
2010
ACM
Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate therm...
DCOSS
2007
Springer
14 years 1 months ago
2007
Springer
With the proliferation of various kinds of sensor networks, we will see large amounts of heterogeneous data. They have different characteristics such as data content, formats, mod...
AICT
2006
IEEE
14 years 1 months ago
2006
IEEE
Web Services are becoming the prominent paradigm for distributed computing and electronic businesses. This makes natural the extension of the concepts at the base of the workflow ...
ICDE
2006
IEEE
14 years 1 months ago
2006
IEEE
A key aspect of any data integration endeavor is establishing a transformation that translates instances of one or more source schemata into instances of a target schema. This sch...