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» Using deformations to explore 3D widget design
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DAC
2007
ACM
14 years 8 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
CHI
1999
ACM
13 years 11 months ago
Interactive 3D Sound Hyperstories for Blind Children
Interactive software is currently used for learning and entertainment purposes. This type of software is not very common among blind children because most computer games and elect...
Mauricio Lumbreras, Jaime Sánchez
ICMCS
1999
IEEE
164views Multimedia» more  ICMCS 1999»
13 years 11 months ago
A Semi-Automatic System to Infer Complex 3-D Shapes from Photographs
We present a semi-automatic image-based modeling system to make 3-D models from photographs. The human operator intervenes only for simple and straightforward tasks. The design of...
Qian Chen, Gérard G. Medioni
ICAD
2004
13 years 8 months ago
Capture and Recreation of Higher-Order 3D Sound Fields via Reciprocity
We propose a unified and simple approach for capturing and recreating 3D sound fields by exploring the reciprocity principle that is satisfied between the two processes. Our appro...
Zhiyun Li, Ramani Duraiswami, Nail A. Gumerov
DAC
2011
ACM
12 years 7 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...