Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Interactive software is currently used for learning and entertainment purposes. This type of software is not very common among blind children because most computer games and elect...
We present a semi-automatic image-based modeling system to make 3-D models from photographs. The human operator intervenes only for simple and straightforward tasks. The design of...
We propose a unified and simple approach for capturing and recreating 3D sound fields by exploring the reciprocity principle that is satisfied between the two processes. Our appro...
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...