Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
We present a model based approach to the integration of multiple cues for tracking high degree of freedom articulated motions and model refinement. We then apply it to the problem...
Shan Lu, Dimitris N. Metaxas, Dimitris Samaras, Jo...
We present various kinds of variational PDE based methods to interpolate missing sinogram data for tomographic image reconstruction. Using the observed sinogram data we inpaint th...
A local cell quality metric is introduced and used to construct a variational functional for a grid smoothing algorithm. A maximum principle is proved and the properties of the loc...
In principle, the recovery and reconstruction of a 3D object from its 2D view projections require the parameterisation of its shape structure and surface re ectance properties. Exp...