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ICCAD
2010
IEEE
216views Hardware» more  ICCAD 2010»
13 years 8 months ago
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok...
CVPR
2003
IEEE
15 years 2 days ago
Using Multiple Cues for Hand Tracking and Model Refinement
We present a model based approach to the integration of multiple cues for tracking high degree of freedom articulated motions and model refinement. We then apply it to the problem...
Shan Lu, Dimitris N. Metaxas, Dimitris Samaras, Jo...
ICPR
2006
IEEE
14 years 11 months ago
Adaptive variational sinogram interpolation of sparsely sampled CT data
We present various kinds of variational PDE based methods to interpolate missing sinogram data for tomographic image reconstruction. Using the observed sinogram data we inpaint th...
Harald Köstler, Marcus Prümmer, Ulrich R...
IMR
2003
Springer
14 years 3 months ago
A Local Cell Quality Metric and Variational Grid Smoothing Algorithm
A local cell quality metric is introduced and used to construct a variational functional for a grid smoothing algorithm. A maximum principle is proved and the properties of the loc...
Larisa Branets, Graham F. Carey
ECCV
2000
Springer
14 years 12 months ago
On Utilising Template and Feature-Based Correspondence in Multi-view Appearance Models
In principle, the recovery and reconstruction of a 3D object from its 2D view projections require the parameterisation of its shape structure and surface re ectance properties. Exp...
Sami Romdhani, Alexandra Psarrou, Shaogang Gong