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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 5 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
IMR
2004
Springer
14 years 2 months ago
3D Hybrid Mesh Generation for Reservoir Flow Simulation
A great challenge for flow simulators of new generation is to gain more accuracy at well proximity within complex geological structures. For this purpose, a new approach based on...
N. Flandrin, Houman Borouchaki, Chakib Bennis
MICCAI
1998
Springer
14 years 1 months ago
Segmentation and Measurement of the Cortex from 3D MR Images
The cortex is the outermost thin layer of gray matter in the brain; geometric measurement of the cortex helps in understanding brain anatomy and function. In the quantitative analy...
Xiaolan Zeng, Lawrence H. Staib, Robert T. Schultz...
SIMVIS
2004
13 years 10 months ago
Model-based Approach to Automatic 3D Seismic Horizon Correlation across Faults
Seismic data provide detailed information about subsurface structures. Reflection events visible in the seismic data are known as horizons, and indicate boundaries between differe...
Fitsum Admasu, Klaus D. Tönnies
GIS
2010
ACM
13 years 3 months ago
Supporting 3D route planning in indoor space based on the LEGO representation
With the prevalence of car navigation systems, indoor navigation systems are increasingly attracting attention in the indoor research area. However, the available models for indoo...
Wenjie Yuan, Markus Schneider