584 search results - page 70 / 117 » Verification-Aware Microprocessor Design |
SC
1992
ACM
13 years 12 months ago
1992
ACM
We are currently developing Willow, a shared-memory multiprocessor whose design provides system capacity and performance capable of supporting over a thousand commercial microproc...
DAC
1998
ACM
13 years 12 months ago
1998
ACM
Interconnect-driven optimization is an increasingly important step in high-performance design. Algorithms for buffer insertion have been successfully utilized to reduce delay in gl...
FPGA
2006
ACM
13 years 11 months ago
2006
ACM
The development of Reed-Solomon (RS) codes has allowed for improved data transmission over a variety of communication media. Although Reed-Solomon decoding provides a powerful def...
ASPLOS
2008
ACM
13 years 9 months ago
2008
ACM
Integrating more processor cores on-die has become the unanimous trend in the microprocessor industry. Most of the current research thrusts using chip multiprocessors (CMPs) as th...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...