1093 search results - page 97 / 219 » Verifying VLSI Circuits |
DAC
2004
ACM
15 years 4 days ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
VLSID
2007
IEEE
14 years 11 months ago
2007
IEEE
As technology scales to 40nm and beyond, intra-die process variability will cause large delay and leakage variations across a chip in addition to expected die-to-die variations. I...
VLSID
2002
IEEE
14 years 11 months ago
2002
IEEE
Interconnect with an insufficient width may be subject to electromigration and eventually cause the failure of the circuit at any time during its lifetime. This problem has gotten...
VLSID
2002
IEEE
14 years 11 months ago
2002
IEEE
In this paper, we propose a new methodology to integrate circuit transformation into routing. More specifically, this paper shows an approach for performing routing and wire recon...
FCCM
2005
IEEE
14 years 4 months ago
2005
IEEE
When designing systems-on-a-chip (SoCs), a unique opportunity exists to generate custom FPGA architectures that are specific to the application domain in which the device will be ...