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MICRO
2006
IEEE
14 years 2 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ASPLOS
2006
ACM
14 years 2 months ago
2006
ACM
The sustained push toward smaller and smaller technology sizes has reached a point where device reliability has moved to the forefront of concerns for next-generation designs. Sil...
USENIX
1994
13 years 10 months ago
1994
Despite impressive advances in file system throughput resulting from technologies such as high-bandwidth networks and disk arrays, file system latency has not improved and in many...
ACMMSP
2004
ACM
14 years 2 months ago
2004
ACM
Instruction combining is an optimization to replace a sequence of instructions with a more efficient instruction yielding the same result in a fewer machine cycles. When we use it...
DAC
2000
ACM
14 years 9 months ago
2000
ACM
Substrate noise caused by large digital circuits will degrade the performance of analog circuits located on the same substrate. To simulate this performance degradation, the total...