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ICCAD
2010
IEEE
139views Hardware» more  ICCAD 2010»
15 years 2 months ago
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
Categories and Subject Descriptors Keywords .
Arvind Sridhar, Alessandro Vincenzi, Martino Ruggi...
JISE
2010
100views more  JISE 2010»
14 years 11 months ago
Example-based Deformation Transfer for 3D Polygon Models
Hung-Kuo Chu, Chao-Hung Lin