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DAC
2010
ACM
14 years 1 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
ISCAS
2006
IEEE
133views Hardware» more  ISCAS 2006»
14 years 3 months ago
Neuronal ion-channel dynamics in silicon
Abstract— We present a simple silicon circuit for modelling voltagedependent ion channels found within neural cells, capturing both the gating particle’s sigmoidal activation (...
Kai M. Hynna, Kwabena Boahen
ASAP
2005
IEEE
165views Hardware» more  ASAP 2005»
14 years 3 months ago
CONAN - A Design Exploration Framework for Reliable Nano-Electronics
In this paper we introduce a design methodology that allows the system/circuit designer to build reliable systems out of unreliable nano-scale components. The central point of our...
Sorin Cotofana, Alexandre Schmid, Yusuf Leblebici,...
MM
2005
ACM
371views Multimedia» more  MM 2005»
14 years 3 months ago
Data grid for large-scale medical image archive and analysis
Storage and retrieval technology for large-scale medical image systems has matured significantly during the past ten years but many implementations still lack cost-effective backu...
H. K. Huang, Aifeng Zhang, Brent J. Liu, Zheng Zho...
SI3D
2005
ACM
14 years 3 months ago
Texture sprites: texture elements splatted on surfaces
We present a new interactive method to texture complex geometries at very high resolution, while using little memory and without the need for a global planar parameterization. We ...
Sylvain Lefebvre, Samuel Hornus, Fabrice Neyret