SRAM-based FPGAs have an inherent capacity for defect tolerance. We propose a simple scheme that exploits this potential in multiple-FPGA systems. The symmetry of the system is ex...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
—The number of CPUs in chip multiprocessors is growing at the Moore’s Law rate, due to continued technology advances. However, new technologies pose serious reliability challen...
Designing a distributed fault tolerance algorithm requires careful analysis of both fault models and diagnosis strategies. A system will fail if there are too many active faults, ...
Aggressive scaling increases the number of devices we can integrate per square millimeter but makes it increasingly difficult to guarantee that each device fabricated has the inte...