2 search results - page 1 / 1 » Yield prediction for 3D capacitive interconnections |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
DATE
2010
IEEE
14 years 14 days ago
2010
IEEE
—3D integration is a key solution to the predicted performance increase of future electronic systems. It offers extreme miniaturization and fabrication of More than Moore product...