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search results - page 143 / 143
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Yield-aware placement optimization
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NANONET
2009
Springer
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Chemistry
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NANONET 2009
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Through Silicon Via-Based Grid for Thermal Control in 3D Chips
14 years 1 months ago
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infoscience.epfl.ch
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
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