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GLVLSI
2009
IEEE
13 years 5 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
DATE
2009
IEEE
14 years 2 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
IWSOS
2009
Springer
14 years 2 months ago
2009
Springer
Internet Coordinate Systems (ICS) provide easy and practical latency predictions in the Internet. However, peer dynamics (i.e, churn), which is an inherent property of peer-to-peer...