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ICCAD
2006
IEEE
14 years 6 months ago
2006
IEEE
Process variations in modern VLSI technologies are growing in both magnitude and dimensionality. To assess performance variability, complex simulation and performance models param...
ICCAD
2006
IEEE
14 years 6 months ago
2006
IEEE
Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the probl...
ICCAD
2006
IEEE
14 years 6 months ago
2006
IEEE
We present global routing optimization methods which are not based on rip-up and re-route framework. In particular, the routing optimization is based on trunk decomposition [13] o...
ICCAD
2006
IEEE
14 years 6 months ago
2006
IEEE
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
ICCAD
2006
IEEE
14 years 6 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...