— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
—We present in this paper a fast and stable global router called NTHU-Route 2.0 that improves the solution quality and runtime of a state-of-the-art router, NTHU-Route, by the fo...
Proteins crystallization is a commonly used technique for protein analysis and subsequent drug design. It predicts the three-dimensional arrangement of the constituent amino acids...
— The emergence of multi-core and many-core processors has introduced new opportunities and challenges to EDA research and development. While the availability of increasing paral...
This paper describes an efficient implementation of an effective sequential synthesis operation that uses induction to detect and merge sequentially-equivalent nodes. State-encodi...
Alan Mishchenko, Michael L. Case, Robert K. Brayto...