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ICCAD
2008
IEEE
14 years 5 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
ICCAD
2008
IEEE
14 years 5 months ago
2008
IEEE
—We present in this paper a fast and stable global router called NTHU-Route 2.0 that improves the solution quality and runtime of a state-of-the-art router, NTHU-Route, by the fo...
ICCAD
2008
IEEE
14 years 5 months ago
2008
IEEE
Proteins crystallization is a commonly used technique for protein analysis and subsequent drug design. It predicts the three-dimensional arrangement of the constituent amino acids...
ICCAD
2008
IEEE
14 years 5 months ago
2008
IEEE
— The emergence of multi-core and many-core processors has introduced new opportunities and challenges to EDA research and development. While the availability of increasing paral...
ICCAD
2008
IEEE
14 years 5 months ago
2008
IEEE
This paper describes an efficient implementation of an effective sequential synthesis operation that uses induction to detect and merge sequentially-equivalent nodes. State-encodi...