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ICCAD
2005
IEEE
14 years 4 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
DAC
2005
ACM
13 years 9 months ago
2005
ACM
Implementing logic blocks in an integrated circuit in terms of repeating or regular geometry patterns [6,7] can provide significant advantages in terms of manufacturability and de...
ICARIS
2005
Springer
14 years 1 months ago
2005
Springer
We propose to develop a theoretical basis and experimental simulator of the first Immune-Computer (IC) as a new kind of biomolecular computer. This IC will be able to control a fra...
ICS
2005
Tsinghua U.
14 years 1 months ago
2005
Tsinghua U.
We present a cache oblivious algorithm for stencil computations, which arise for example in finite-difference methods. Our algorithm applies to arbitrary stencils in n-dimension...