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DATE
2010
IEEE
142views Hardware» more  DATE 2010»
14 years 4 months ago
Testing TSV-based three-dimensional stacked ICs
To meet customer’s product-quality expectations, each individual IC needs to be tested for manufacturing defects incurred during its many high-precision, and hence defect-prone ...
Erik Jan Marinissen
ISQED
2010
IEEE
120views Hardware» more  ISQED 2010»
14 years 5 months ago
Methodology from chaos in IC implementation
— Algorithms and tools used for IC implementation do not show deterministic and predictable behaviors with input parameter changes. Due to suboptimality and inaccuracy of underly...
Kwangok Jeong, Andrew B. Kahng
ICS
2010
Tsinghua U.
14 years 3 months ago
Robust Perfect Revenue From Perfectly Informed Players
: Maximizing revenue in the presence of perfectly informed players is a well known goal in mechanism design. Yet, all current mechanisms for this goal are vulnerable to equilibrium...
Jing Chen, Avinatan Hassidim, Silvio Micali
APCCM
2010
13 years 12 months ago
Metric of intrinsic information content for measuring semantic similarity in an ontology
Measuring information content (IC) from the intrinsic information of an ontology is an important however a formidable task. IC is useful for further measurement of the semantic si...
Md. Seddiqui Hanif, Masaki Aono
VLSI
2010
Springer
13 years 9 months ago
Design and feasibility of multi-Gb/s quasi-serial vertical interconnects based on TSVs for 3D ICs
—This paper proposes a novel technique to exploit the high bandwidth offered by through silicon vias (TSVs). In the proposed approach, synchronous parallel 3D links are replaced ...
Fengda Sun, Alessandro Cevrero, Panagiotis Athanas...