Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
In this paper, we propose a new method to integrate multiview normal fields using level sets. In contrast with conventional normal integration algorithms used in shape from shadin...
Data integration has evolved to provide efficient data management across distributed and heterogeneous data sources in grid environment. However, existing works in data integratio...
Yongwei Wu, Jia Liu, Gang Chen, Guangwen Yang, Bo ...
Abstract Current, data-driven applications have become more dynamic in nature, with the need to respond to events generated from distributed sources or to react to information extr...
: Mobile devices are becoming ubiquitous in everyday’s life, their popularity and place independence are reasons for using these devices in different areas. One such area is elec...