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DAC
2012
ACM
12 years 22 days ago
2012
ACM
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
DAC
2012
ACM
12 years 22 days ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
DAC
2012
ACM
12 years 22 days ago
2012
ACM
Unknown values (Xs) may exist in a design due to uninitialized registers or blocks that are powered down. Due to X-pessimism in gate-level logic simulation, such Xs cannot be hand...
DAC
2012
ACM
12 years 22 days ago
2012
ACM
In this work we address the problem of managing interconnect timing in high-level synthesis by generating a layoutfriendly microarchitecture. A metric called spreading score is pr...
DAC
2012
ACM
12 years 22 days ago
2012
ACM
Addressing the challenges of extreme scale computing requires holistic design of new programming models and systems that support those models. This paper discusses the Angstrom pr...