DAC
2007
ACM
14 years 3 months ago
2007
ACM
It is now widely believed that FlexRay will emerge as the predominant protocol for in-vehicle automotive communication systems. As a result, there has been a lot of recent interes...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
SoC based system developments commonly employ ESL design ogies and utilize multiple levels of abstract models to provide feasibility study models for architects and development pl...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
While cryptographic algorithms are usually strong against mathematical attacks, their practical implementation, both in software and in hardware, opens the door to side-channel at...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
A growing number of networked applications is implemented on increasingly complex automotive platforms with several bus standards and gateways. Together, they challenge the automo...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
It has long been the practice to create models in C or C++ for architectural studies, software prototyping and RTL verification in the design of Systems-on-Chip (SoC). It is often...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
We present a framework for validating the compliance of a design with a given architecture. Our approach is centered on the concept of misinterpretations. These include missing be...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
With the continuous increase of circuit density, interconnect length, and aspect ratio, the influence of capacitive and inductive coupling on timing characteristics of integrated ...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
The number of features that are supported in modern multimedia devices is increasing faster than ever. Estimating the performance of such applications when they are running on sha...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
Mixed Vt has been widely used to control leakage without affecting circuit performance. However, current approaches target the combinational circuits even though sequential elemen...
DAC
2007
ACM
14 years 3 months ago
2007
ACM
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...